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WLP-Packaging MVP Design
WLP-Packaging MVP Design
MVP Design
NEMOTEK is the first provider of SHELLCASE® MVP technology providing a complete wafer-level chip scaled packaging solution to all types of image sensors for today’s growing demand. SHELLCASE® MVP is based on the core SHELLCASE® technologies serving more than 40% of the image sensors market.
- Available with BGA or LGA termination, applicable for standard SMT assembly
- Applicable for probe card/ image socket testing
- Applicable for Wafer-level-Camera assembly
- Unique encapsulation technique enables Reliability level that meets Automotive standards
- Meets all environmental conditions
|
Cover glass, μm |
Min scribe line, μm |
Cavity type package thickness, μm | Non-cavity type package thickness, μm |
|---|---|---|---|
| 300 | 70 | 470 | 435 |
| 400 | 100 | 570 | 535 |
| 500 | 100 | 670 | 635 |
|
BGA pitch , μm |
Max. ball Ø , μm |
|---|---|
| 450 | 200 (hemisphere) |
| 500 | 200 |
| 650-800 | 350 |
| 1000-1300 | 500 |
Download datasheet 