Nemotek Our technologies
Our technologies
OptiML ™ Wafer Level Optics
Nemotek Technologie acquired the licence to use the OptiML ™ Wafer Level Optics technology from Tessera. This technology allows to build thousands of lenses simultaneously on a wafer and create optical elements that are mounted directly onto a packaged image sensor. This wafer-level approach enables to achieve economies of scale while producing reliable and cost effective lenses.
Shellcase® MVP packaging technology
Nemotek Technologie is the first provider of Shellcase® MVP, a true through silicon via ”TSV” technology providing a complete wafer-level chip scaled packaging solution to all types of high volume image sensors available on the market. This solution is based on the proven Shellcase technologies serving over 40% of the image sensors market.
Wafer Level Camera
The Wafer Level Camera offered By Nemotek Technologie is the combination of the Shellcase® MVP packaging technology and the OptiML ™ Wafer Level Optics technology. This Camera technology based on wafer-level processing makes possible the manufacturing of cameras at the wafer level, drastically reducing the size and total bill of materials cost of conventional camera modules.